I-Intel's Powervia Technology iyinto entsha emisha ngezindlela zendabuko ze-Chip Power Supply futhi kulindeleke ukuthi zikhiqizwe isisindo kwinqubo ye-Intel 20a ilandelana engxenyeni yokuqala yoMthetho we-Moore.Inqubo yayo yokuthuthuka yenziwa ngokuzimela kusuka kwa-Ribbonfet transistors ukuqinisekisa ukuthi i-Powervia ingasetshenziswa ngempumelelo ku-Intel 20a Procust Production.Ngokuhlola okubanzi kanye nokulungisa iphutha le-Powervia kuma-node angaphakathi wokuhlola, i-Intel isiqinisekisile iqhaza layo elibalulekile ekwenzeni ngcono ukusebenza kwe-chip.Izinga lokusetshenziswa kweyunithi lidlula ama-90%, futhi lingakhuthaza kakhulu ubuchwepheshe be-transistor shrinsage futhi basize izinkampani zokwakhiwa kweChip zithuthukisa imikhiqizo yazo.ukusebenza kanye nokusebenza kwamandla.
I-Intel ikholelwa ukuthi ubuchwepheshe be-Powervia bungenye ingqophamlando ngemuva kweFinfet.Ngenkathi kungenzeka ukuthi i-Ribbonfet ingaba nethuba eliphelele ngaphezulu kwe-Gaafet Technologies, ukuhola kwe-Powervia kucacile.Umkhakha awulindeli ukuthi i-TSMC isebenzise ubuchwepheshe obufanayo ngaphambi kokufika kwe-N2P ngasekupheleni kwama-silico asendulo ubuchwepheshe obufana ne-Silicon, ekhombisa ukuhanjiswa okuqhubekayo kwe-Intel..
Kuyafaneleka ukusho ukuthi ukwethulwa kwenqubo yenqubo ye-Intel's 20a kanye ne-18a ngeke kusebenzele ukuthuthuka kwemikhiqizo ye-Intel, kodwa futhi kuzoba nomthelela omkhulu emkhakheni wonke we-chip kanye nezinsizakalo ze-Intel ze-Intel.Lokhu kuphawula ukufika okusemthethweni kwe-Intel ye-Angstrom Era futhi kuvula isahluko esisha kubuchwepheshe be-chip.
I-Backside Power Supply Network (BS-PDN), njengomunye wezobuchwepheshe obusezingeni eliphansi kwe-Powervia, ivele buthule emkhakheni we-chip we-chip afana nobuchwepheshe be-EUV, futhi ibhekwa njengesisekelo sokuqhubeka nokukhuthaza ukuthuthukiswa kwezindawo zenqubo ezinhle.Ukusuka ezigabeni zokuqala zokukhiqiza ama-chip, ukwakhiwa kwenethiwekhi yokulethwa kwamandla kudinga ukulawulwa okuqondile, ukuqala kusuka ku-etching ungqimba olungaphansi lwe-transistor ekunikezelweni kwamandla engxenyeni ephezulu.Le nqubo idinga ukwesekwa kwamathuluzi anembe okuphezulu anjenge-EUV nobuchwepheshe obuningi bokuvezwa.Lokhu kwakhiwa okuyinkimbinkimbi futhi okuqondile okwenza ukukhiqiza ama-chip kuyinqubo ebizayo neyinkimbinkimbi, kepha futhi kuyisihluthulelo sokwenza ngcono ukusebenza kwe-chip kanye nokusebenza kahle.
Ngalesi sisekelo, ngokwakha izingqimba zensimbi eziningi, ama-elektroni angadluliselwa ngempumelelo phakathi kwama-transistors ukuhlinzeka amandla adingekayo nezimpawu ezingxenyeni ezahlukahlukene ze-chip.I-Intel ifaka inqubo yokwenza i-pizza, futhi ngenkathi izwakala ibe lula, isilinganiselo esibonisa kahle ubunzima be-chip bekhiqiza.Njengoba kuthuthukiswa ubuchwepheshe, amapulani aphezulu okusebenza kahle avame ukuqukatha izingqimba eziningi zensimbi kuya kwezingu-10 kuye kwezingu-20, futhi uma i-chip ikhiqizwa, i-chip ivame ukugcwala ukuze kufakwe i-Chip kanye ne-transistorsziphezulu..Inzuzo yalolu daba lwe-Flip-Chip ukuthi kulula ukukwenza iphutha futhi upholise i-chip, kodwa futhi iletha nezinselelo eziningi zamandla okuphela.
Kwangeniswa amandla ukubhekana nalezi zinselelo.Ngokuhlukanisa amanethiwekhi okuhambisa ama-Signal kanye nokwakha amandla kanye nokwakha inethiwekhi yokuhlinzekwa kwamandla ngemuva kwe-chip, i-Powervia yenza lula ukwakheka kwe-chip futhi kwenza kube nokwenzeka ukuthuthukisa ukusebenza kwe-chip.Inzuzo eqondile yale ndlela yokuhlinzekwa kwamandla emuva emuva ukuthi ayitholakali kuphela imithetho yokwakha yesendlalelo sensimbi futhi ithuthukise izinga le-design yenkululeko, kepha linciphisa ukusebenza kahle kwe-IR DROOP, kuthuthukisa ukuphazamiseka, futhi ngaleyo ndlela kuxazulula inkinga yedatha inkinga yokuxhumana ne-bottleneck ephathe umkhakha iminyaka eyishumi.
Vele, ukusetshenziswa kobuchwepheshe be-Powervia nakho kubhekana nezinselelo zalo.Njengoba i-transistor ungqimba itholakala maphakathi ne-chip kunokuba emaphethelweni, amathuluzi endabuko wokulungisa iphutha awakwazi ukufinyelela ngqo ungqimba we-transistor ukuze uhlolwe.Manje sekunezingqimba ezingaba ngu-15 zemigqa yesiginali phakathi kwesendlalelo se-transistor kanye nongqimba wokuhlanza ukushisa.Le nselelo, ngenkathi iyesabeka, ayinakunqotshwa.I-Intel iqinisekisile ngempumelelo ukusebenza kwalezi zinqubo zokulungisa iphutha ngokuqamba amaphutha athile alawulekayo futhi kusetshenziswe ithuluzi layo lokulungisa iphutha le-Powervia.Ngasikhathi sinye, ubuchwepheshe bokwakha ungqimba lwamandla ngemuva kwe-chip nakho akukaze kube khona.Kwandisa ubunzima benqubo yokukhiqiza kanye nokuthi kungenzeka amaphutha.Kodwa-ke, i-Intel ithuthukise ngempumelelo ukuqina kanye nokwethenjwa kwenqubo yokukhiqiza ngokusebenzisa ama-Carrier Wafers kanye ne-TSV Technology..
Ekugcineni, i-Intel ikuqinisekisile impumelelo ye-Powervia Technology ngekhodi ye-chip ye-chip-ogama elithi "Blue Sky Creek."Yize i-Powervia inobungozi obuphakeme bokuqalisa ubungozi, ngokuyihlanganisa nenqubo ye-Intel 4 kanye ne-Intel Euv, i-Intel ibonise ubuchwepheshe obukhulu be-powervia ekuthuthukiseni iyunithi yokusetshenziswa, kanye nokukhulisa ukusebenza kwendawo yokuhlala okuhleIzici.Lolu chungechunge lwemiphumela yokuhlola lungabonakali kuphela ukuthi kungenzeka yini ukuthi kungenzeka ubuchwepheshe be-powervia, kodwa futhi ikhombisa amandla ayo amakhulu entuthukweni yezobuchwepheshe be-chip.