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Itekhnoloji ye-Intel ye-Intel ye-Intel I-Eelvia ngasemva kulindeleke ukuba iveliswe ngobunzima

Itekhnoloji ye-Intel ye-Intel yeyona nto iphambili kwi-Chip Windes zokuhambisa amandla kwaye kulindeleke ukuba kuveliswe ubunzima kwi-Intel 20A Supect kwiSiqingatha sokuqala se-2024.Inkqubo yayo yophuhliso iqhutywa ngokuzimeleyo ukusuka kwi-ribbonfet ivela kwi-ribbonfet iyokuqinisekisa ukuba i-Andvaia ingasetyenziswa ngokufanelekileyo kwi-Intel 20A ne-18A yenkqubo yeChip.Ngokusebenzisa uvavanyo olubanzi kunye nokuhlambulula kwe-Forvia kwiindawo zovavanyo lwangaphakathi, i-Intel iqinisekisile indima yayo ekuphuculeni ukusebenza ngempumelelo kwe-chip.Iqondo lokusetyenziswa kweyunithi lingaphezulu kwe-90%, kwaye inokunyusa kakhulu itekhnoloji ye-Shristor kunye neeNkalo zoncedo ze-chip ziphucula iimveliso zabo.intsebenzo kunye nokusebenza kwamandla.
I-Intel iyakholelwa ekubeni itekhnoloji ye-Worldvia yenye into ebalulekileyo emva kweFinFET.Ngelixa iRibbonft isenokungabi naluncedo olupheleleyo malunga netekhnoloji yokukhuphisana ngetekhnoloji ye-Gafat, isikhokelo se-Purvia sicacile.Umzi mveliso awulindelanga i-TSMC ukuba inxibe itekhnoloji efanayo ngaphambi kweendawo ze-N2P ekwi-2026 okanye ekuqaleni kwamasango exesha elidlulileyo le-silicon, ebonisa ubunkokeli obuqinisekileyo be-Intel.
Kufanelekile ukukhankanya ukuba ukusungulwa kwe-Intel ye-Intel ye-Intel 20A kunye ne-18a ayizukufumana nje ukuqhubela phambili kweemveliso ze-Intel, kodwa kuya kuba nefuthe elikhulu kwi-Chip lonke le-CCL kunye neenkonzo ze-Intel.Le ndlu ye-Intel ye-Intel ifikile ixesha le-Angstrom kwaye ivula isahluko esitsha kwitekhnoloji ye-Chip.
Inethiwekhi ye-Bar-PDN), njengomnye wetekhnoloji engundoqo ye-chip, ithe cwaka kwiCandelo leMveliso ye-chii, kwaye ithathwa njengesiseko sokukhuthaza ukuphuculwa kweendawo zenkqubo yenkqubo yenkqubo yenkqubo yenkqubo yenkqubo yenkqubo yenkqubo yenkqubo.Ukusuka kumanqanaba angaphambili okwenza i-chip, ukwakhiwa kwenethiwekhi yokuhambisa amandla kufuna ulawulo oluchanekileyo, ukuqala ngokubeka i-etchise yomatshini wokuhambisa amandla kumbane ophezulu.Le nkqubo ifuna ukuxhaswa kwezixhobo eziphezulu zokuchaneka njenge-EUV kunye netekhnoloji yokubonisa ezininzi.Olu luhlu lubaluleke kakhulu kwaye luchaze inkqubo eyenza i-chip ivelisa inkqubo ebiza ixabiso elibi nexineneyo, kodwa ikwasisitshixo sokuphucula ukusebenza kwe-chip kunye nokusebenza kakuhle.

Kule nto, ngokwakhiwa kweendawo ezininzi zentsimbi, ii-elektroniki zinokudluliselwa ngempumelelo phakathi koziso ukubonelela ngamandla afunekayo kunye nemiqondiso eyahlukeneyo ye-chip.I-Intel ifanisa inkqubo yokwenza ipitsa, kwaye ngelixa isenokuvakala ilula, isifaniso sibonisa ngokucacileyo ubunzima bemveliso ye-chiip.Njengoko inkqubela phambili yetekhnoloji, iprosesa yokusebenza kakhulu yale mihla ihlala inee-10 ukuya kwi-20 imilebe, kwaye xa sele i-chip yenziwe, i-chip idla ngokugqithisileyo ukuze i-chip kunye ne-chipziphezulu..Inzuzo yale uyilo lwe-chip-chip kukuba kulula ukuyihlambulula kwaye kupholise i-chip, kodwa ikwazisa imiceli mngeni emininzi kumbane wangaphambili.
Yaziswa ukujongana nale miceli mngeni.Ngokwahlulahlula uthungelwano lothungelwano kunye nolwakhiwo lwenethiwekhi kunye nokwakha inethiwekhi yokuhambisa amandla ngasemva kwe-chip, i-roundvia iyenza lula ubume be-chip kwaye yenza ukuba ikwazi ukuphucula ukusebenza kwe-chip kwaye kwenza ukuba ikwazi ukuphucula ukusebenza kwe-chip kwaye kwenza ukuba ikwazi ukuphucula ukusebenza kwe-chip kwaye kwenza ukuba ikwazi ukuphucula ukusebenza kwe-chip kwaye kwenza ukuba kwenzeke ukuphucula ukusebenza kwe-chip kwaye kwenza ukuba ikwazi ukuphucula ukusebenza kwe-chip kwaye kwenza ukuba kwenzeke ukuphucula ukusebenza kwe-chip kwaye kwenza ukuba ikwazi ukuphucula ukusebenza kwe-chip kwaye kwenza ukuba kwenzeke ukuphucula ukusebenza kwe-chip kwaye kwenza ukuba ikwazi ukuphucula ukusebenza kwe-chip kwaye kwenza ukuba ikwazi ukuphucula ukusebenza kwe-chip kwaye kwenza ukuba ikwazi ukuphucula ukusebenza kwe-chip kwaye kwenza ukuba kwenzeke ukuphucula ukusebenza kwe-chip kwaye kwenza ukuba ikwazi ukuphucula ukusebenza kwe-chip kwaye kwenza ukuba ikwazi ukuphucula ukusebenza kwe-chip kwaye kwenza ukuba ikwazi ukuphucula ukusebenza kwe-chip kwaye kwenza ukuba kwenzeke ukuphucula ukusebenza kwe-chip kwaye kwenza ukuba ikwazi ukuphucula ukusebenza kwe-chip kwaye kwenza ukuba ikwazi ukuphucula ukusebenza kwe-CHIP.Isibonelelo sengqawulesi sale ndlela yokubonelela yasemva kwendlela kukuba ayiphumi nje imithetho yoyilo ye-iron kwaye icothise i-IR ye-IR, kodwa iphucula amandla e-IR Droop ye-CHIP, isuse ukuphazamiseka, kwaye ke ngoko isombulula ingxaki yokufunda i-ItConNneck I-Itternecker Inforneck yelishumi leminyaka.
Ewe kunjalo, ukuphunyezwa kwetekhnoloji ye-Wornderia nayo ijongene nemiceli mngeni yakhe.Ukusukela ukuba umlinganiso we-wintistor ukhona phakathi kwe-chip endaweni yokuphela, izixhobo zokulungisa ubulungisa azinakufikelela ngqo kwi-chistrar kuvavanyo.Ngoku kukho malunga ne-15 lezigca zemigca yomqondiso phakathi komaleko we-tedistor kunye ne-face the sperication.Olu celomngeni, ngelixa lufuna, alinakukoyiswa.I-Intel iqinisekise ngempumelelo ukusebenza kwezi nkqubo zokwenza izinto ngokuyila iziphene ezinokulawulwa nokusebenzisa isixhobo sayo se-Wordvia.Kwangelo xesha, itekhnoloji yokwakha ungqimba lwamandla ngasemva kweChip ayizange ibonwe ngaphambili.Iyonyusa ubunzulu benkqubo yokwenziwa kunye nokubakho kwezimpazamo.Nangona kunjalo, i-Intel iphucule ngokufanelekileyo uzinzo kunye nokuthembeka kwenkqubo yokwenziwa kwemveliso ngokusebenzisa ii-wafiers zemoto kunye netekhnoloji ye-TSV..
Okokugqibela, i-Intel iqinisekisa impumelelo ye-Andvia ngeKhowudi ye-chip yovavanyo-ebizwa ngokuba yi "Blue Shrky Creek."Nangona iAtyvia inomngcipheko ophezulu wokuphunyezwa kobugcisa, ngokudibanisa nge-Intel 4 yeTekhnoloji ye-EUV, i-Intel ibonakalisile izibonelelo ezibalulekileyo ze-Endvia ekuphuculeni ukusetyenziswa kwesebe, ngelixa ikwandisa ukulimaza kwe-frequencyIimpawu.Olu thotho lweziphumo zovavanyo azingqina nje ukuba kunokwenzeka kwitekhnoloji ye-Wornderia, kodwa ikwabonisa amandla amakhulu ayo kwinkqubela phambili yetekhnoloji yexesha elizayo.